Jon Takacs Log - Revision history

Takacsjd: IEC 61499 as a widely adopted hardware agnostic event based distributed standard programing language for all OSE machines.

2026-03-24T15:10:32Z

IEC 61499 as a widely adopted hardware agnostic event based distributed standard programing language for all OSE machines.

← Older revision		Revision as of 15:10, 24 March 2026
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	{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}		{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}

			==3/24/2026==
			IEC 61499 is a perfect standard for OSE machines.
			Schneider electric recently presented it, it is an open standard and is controlling sites as large as an exon oil refinery.

			Eclipse 4IDAC is the IDE for it, and is very user friendly and open

			It is a holonic, industrial control language that is event based.
			So, basically you can define an entire plant with function blocks, then circle and drag those blocks to hardware reasources you have

			Raspi, computers, ESP32, arduinos (high end arduinos)

			Then it automatically setups mesh UDP TCP/IP sockets between the machines to accomplish needed communication.

			as it is event based, code only runs when there is something happening or a change in data.

			so, consider for the liberator press function blocks can be created for hydralics, sensors and other pieces by drag and drop; and whatever avaiable controller can be used.

Takacsjd at 19:31, 16 March 2026

2026-03-16T19:31:14Z

← Older revision		Revision as of 19:31, 16 March 2026
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	===Great well rig drill video===		==Great well rig drill video==
	https://www.youtube.com/watch?v=79wHBi92w6c		https://www.youtube.com/watch?v=79wHBi92w6c

			=Utrecht=
			EU Incentives for OSE.
			In general, the Dutch and Polish culture are focused on sustainability. As products will have assembly instructions, they can also have assembly instructions that... Disassemble and create more products than what goes in.
			like, an machine that reclaims OSE circuits for use somewhere else, and sends metal and plastic parts for re-use or recycle.

			=EU Grants and Investitive programs=
			===Horizon Europe===
			Cluster 4 (Digital Industry Space)
			EIC Accelerator - deep tech with high risk and impact
			boot European critical raw materials value chain
			Advance materials for circularity

Takacsjd at 18:49, 16 March 2026

2026-03-16T18:49:18Z

← Older revision		Revision as of 18:49, 16 March 2026
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	====Holonic System modeling====		====Holonic System modeling====
	~~**PDL**~~		__PDL__
	A key feature is modeling parts as holons. A hologram, when split contains the entire image.		A key feature is modeling parts as holons. A hologram, when split contains the entire image.
	So, each finished OSE machine is modeled as a part.		So, each finished OSE machine is modeled as a part.
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	Inputs might be a single part, but tooling would be cameras / measurement equipment or test equipment.		Inputs might be a single part, but tooling would be cameras / measurement equipment or test equipment.

	**Holonic Machine control**		__Holonic Machine control__
	At my day job, I work with DCS (distributed control system) controllers.		At my day job, I work with DCS (distributed control system) controllers.
	Each of these PLC controllers contains the entire plant, and can control all the plant devices and runs the same program.		Each of these PLC controllers contains the entire plant, and can control all the plant devices and runs the same program.

Takacsjd: What I've been doing past 5 years.

2026-03-16T18:48:26Z

What I've been doing past 5 years.

Show changes

Takacsjd: Back at it - OSE MES business plan and proposing a project to my day job company to develop OSE MES. Working on automated print farm and storage bin units + industrial material handling robots.

2021-10-28T19:54:27Z

Back at it - OSE MES business plan and proposing a project to my day job company to develop OSE MES. Working on automated print farm and storage bin units + industrial material handling robots.

← Older revision		Revision as of 19:54, 28 October 2021
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	{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}		{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}

			==10/28/2021==
			Hard year with a house fire. My company is also making the vaccine, so was out for a while doing that.
			With a good chunk of money, I'm hoping to have my company work on developing OSE MES.

			I have parts for 3 D3D printers, and have 3 ender 3's.

			Continuing work again on robotic system for printing and removing magnetic beds from printers.

			Also starting work on business plan - [[OSE_MES Business Plan]]

	==8/8/2021==		==8/8/2021==

Takacsjd: Long due update.

2021-08-10T00:45:17Z

Long due update.

← Older revision		Revision as of 00:45, 10 August 2021
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	{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}		{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}

			==8/8/2021==
			Making robotic platform for managing printers. Still working on MES for printers.

			Hoping to get things together.

			Finally got the 12x12 raising by increasing motor current on stepper board.


	==4/20/2020 to 4/26/2020==		==4/20/2020 to 4/26/2020==

Marcin: Marcin moved page TakacsLog to Jon Takacs Log without leaving a redirect

2021-08-09T12:01:45Z

Marcin moved page TakacsLog to Jon Takacs Log without leaving a redirect

← Older revision	Revision as of 12:01, 9 August 2021
(No difference)

Marcin: /* 4/20/2020 to 4/26/2020 */

2020-04-27T15:00:15Z

4/20/2020 to 4/26/2020

← Older revision		Revision as of 15:00, 27 April 2020
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	*Still an issue with torque rating bed with both z stepper properly set? Need to look into this. Even had this issue without microstepping (removed jumpers)..'''See if your 2 steppers are identical. If they are not, one may draw more juice and weaken the other.Swap out stepper driver from other sockets and see if it's a bad driver.'''		*Still an issue with torque rating bed with both z stepper properly set? Need to look into this. Even had this issue without microstepping (removed jumpers)..'''See if your 2 steppers are identical. If they are not, one may draw more juice and weaken the other.Swap out stepper driver from other sockets and see if it's a bad driver.'''
	*Needed fiberglass to get 12" China Heated pad up to 110 C - otherwise topped out at 94C and threw temp overrun errors.		*Needed fiberglass to get 12" China Heated pad up to 110 C - otherwise topped out at 94C and threw temp overrun errors.
	* E steps per MM WAY off for x, y, z. what is it? Could of also led to torque issues.		* E steps per MM WAY off for x, y, z. what is it? Could of also led to torque issues. '''Which extruder are you using? 425 for E3D, 100 for Universal Gearless.'''

Marcin: /* 4/20/2020 to 4/26/2020 */

2020-04-27T14:58:51Z

4/20/2020 to 4/26/2020

← Older revision		Revision as of 14:58, 27 April 2020
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	==4/20/2020 to 4/26/2020==		==4/20/2020 to 4/26/2020==
	D3D oh 12" work.		D3D oh 12" work.
	*Still an issue with torque rating bed with both z stepper properly set? Need to look into this. Even had this issue without microstepping (removed jumpers)		*Still an issue with torque rating bed with both z stepper properly set? Need to look into this. Even had this issue without microstepping (removed jumpers)..'''See if your 2 steppers are identical. If they are not, one may draw more juice and weaken the other.Swap out stepper driver from other sockets and see if it's a bad driver.'''
	*Needed fiberglass to get 12" China Heated pad up to 110 C - otherwise topped out at 94C and threw temp overrun errors.		*Needed fiberglass to get 12" China Heated pad up to 110 C - otherwise topped out at 94C and threw temp overrun errors.
	* E steps per MM WAY off for x, y, z. what is it? Could of also led to torque issues.		* E steps per MM WAY off for x, y, z. what is it? Could of also led to torque issues.


	Making parts for a D3D universal.		Making parts for a D3D universal.

	==2/16/2020 to 3/20/2020==		==2/16/2020 to 3/20/2020==

Takacsjd: updates. Really trying to finally finish D3D OH and move on to D3D universals for print farm and MES.

2020-04-27T04:01:22Z

updates. Really trying to finally finish D3D OH and move on to D3D universals for print farm and MES.

← Older revision		Revision as of 04:01, 27 April 2020
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	{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}		{{Status\|NONE\|MES concept design. D3DOH Printer Startup\|Time available}}

			==4/20/2020 to 4/26/2020==
			D3D oh 12" work.
			*Still an issue with torque rating bed with both z stepper properly set? Need to look into this. Even had this issue without microstepping (removed jumpers)
			*Needed fiberglass to get 12" China Heated pad up to 110 C - otherwise topped out at 94C and threw temp overrun errors.
			* E steps per MM WAY off for x, y, z. what is it? Could of also led to torque issues.


			Making parts for a D3D universal.

	==2/16/2020 to 3/20/2020==		==2/16/2020 to 3/20/2020==