OSE 3D Printed Circuits - Revision history

Marcin: /* OSE Relevance */

2019-04-30T16:48:42Z

OSE Relevance

← Older revision		Revision as of 16:48, 30 April 2019
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	=OSE Relevance=		=OSE Relevance=
	*In upcoming [[Incentive Challenge]] - we can require structure integrated circuits that are 3D printed in 3D, and fully recyclable!		*In upcoming [[Incentive Challenge]] - we can require structure integrated circuits that are 3D printed in 3D, and fully recyclable!

			=Links=
			*[[Circuits on Plastic]]

Takacsjd: /* Other ideas */

2019-04-29T15:27:20Z

Other ideas

← Older revision		Revision as of 15:27, 29 April 2019
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	Cons:		Cons:
	*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]		*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]
			**Could this be mitigated by printing a nest for SMA parts then using conductive ink where they part is depressed onto the cradle?

	[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|374px]]		[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|374px]]

Takacsjd: NICE!!! - Suggested tests for printing the circuit traces in this with conductive ink.

2019-04-29T15:25:38Z

NICE!!! - Suggested tests for printing the circuit traces in this with conductive ink.

← Older revision		Revision as of 15:25, 29 April 2019
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	#Terminal blocks can be 3d printed in place!		#Terminal blocks can be 3d printed in place!
	#Note that we can make connectable modules with this technique, where 3D circuit blocks can plug into one another.		#Note that we can make connectable modules with this technique, where 3D circuit blocks can plug into one another.

			=Other ideas=
			*TEST using a dual extruder printer to place conductive fulfillment in a print.
			** such as, but would want lower resistance than 100kohm... https://hobbyking.com/en_us/conduct-electricity-abs-3d-printer-filament.html?countrycode=US&gclid=CjwKCAjwwZrmBRA7EiwA4iMzBI_jQE3oiTDjLxUGxKI7EA9xk4DzdBZ3MGNXzdm0TRXLhxfncVG2HBoC0qgQAvD_BwE&gclsrc=aw.ds
			*TEST: Conductive filament could be shaped in such a way as to achieve a spring like grabbing of electronic parts?
			*TEST: Could other features be printed to push SMA or other topologies onto these printed pins? think of placing the parts and having pressure applied from a heatsink above to press onto these special "pins"

	Pros:		Pros:

Marcin at 20:55, 28 April 2019

2019-04-28T20:55:27Z

← Older revision		Revision as of 20:55, 28 April 2019
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	*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]		*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]

	[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|~~373px~~]]		[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|374px]]

Marcin at 20:55, 28 April 2019

2019-04-28T20:55:19Z

← Older revision		Revision as of 20:55, 28 April 2019
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	*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]		*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]

	[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|~~370px~~]]		[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|373px]]

Marcin at 20:55, 28 April 2019

2019-04-28T20:55:09Z

← Older revision		Revision as of 20:55, 28 April 2019
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	*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]		*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]

	[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|~~400px~~]]		[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|370px]]

Marcin at 20:54, 28 April 2019

2019-04-28T20:54:59Z

← Older revision		Revision as of 20:54, 28 April 2019
Line 15:		Line 15:
	*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]		*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]

	[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|~~300px~~]]		[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|400px]]

Marcin at 20:54, 28 April 2019

2019-04-28T20:54:28Z

← Older revision		Revision as of 20:54, 28 April 2019
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	(Not OSE circuits. See [[Dead-Bug_Soldering]] ~~and~~ [[Circuits on Plastic]] for source.)		(Not OSE circuits. See [[Dead-Bug_Soldering]], [[Circuits on Plastic]], and [[Snap Together 3D Printed Electronics Modules]] for source.)

	=OSE Relevance=		=OSE Relevance=
	*In upcoming [[Incentive Challenge]] - we can require structure integrated circuits that are 3D printed in 3D, and fully recyclable!		*In upcoming [[Incentive Challenge]] - we can require structure integrated circuits that are 3D printed in 3D, and fully recyclable!

Marcin at 20:53, 28 April 2019

2019-04-28T20:53:50Z

← Older revision		Revision as of 20:53, 28 April 2019
Line 15:		Line 15:
	*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]		*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]

	[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]]		[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]][[File:nanoracing.jpg\|300px]]


	(Not OSE circuits. See [[Dead-Bug_Soldering]] and [[Circuits on Plastic]] for source.)		(Not OSE circuits. See [[Dead-Bug_Soldering]] and [[Circuits on Plastic]] for source.)

Marcin at 20:50, 28 April 2019

2019-04-28T20:50:59Z

← Older revision		Revision as of 20:50, 28 April 2019
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	#This is not fine for small feature advanced microelectronics, but 2.54 mm components would work.		#This is not fine for small feature advanced microelectronics, but 2.54 mm components would work.
	#Soldering is quick for 2 wire components that touch each other. We can have the 3D print serve as a holding structure that makes soldering easy.		#Soldering is quick for 2 wire components that touch each other. We can have the 3D print serve as a holding structure that makes soldering easy.
	#2nd option: wires snap in place if printed from elastomer. Ga 10 or 8 solid copper - just snap it in. Circuit cover finishes circuit. Components become 100% reusable!		#2nd option: wires snap in place if printed from elastomer. Ga 10 or 8 solid copper - just snap it in. Locking, snap-in Circuit cover finishes circuit. Components become 100% reusable!
	#3rd connection option: Not also - if 2 leads are inserted into a hole, the hole can be plugged with a solid copper conductor for good contact.		#3rd connection option: Not also - if 2 leads are inserted into a hole, the hole can be plugged with a solid copper conductor for good contact.
			#Terminal blocks can be 3d printed in place!
			#Note that we can make connectable modules with this technique, where 3D circuit blocks can plug into one another.

			Pros:
			*Full 3D, body-integrated circuits can be produced.
			Cons:
			*Cons: limited to relatively large components - such as atmega328p DIP. But socketing can extend range of applicability, such as SOIC to SMT [https://www.mouser.com/ProductDetail/Chip-Quik/PA0006?qs=gjT6naH6P5I5sSiXDu4Wxw%3D%3D&gclid=EAIaIQobChMIz4aH1NTz4QIVGrbACh17UwRbEAQYASABEgJmmvD_BwE]

	[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]]		[[File:plasticcircuit.png\|300px]][[File:deadbugarduino.jpg\|300px]]
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	=OSE Relevance=		=OSE Relevance=
	*In upcoming [[Incentive Challenge]] - we can require structure integrated circuits that are 3D printed in 3D.		*In upcoming [[Incentive Challenge]] - we can require structure integrated circuits that are 3D printed in 3D, and fully recyclable!