Soldering 101: Difference between revisions

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(Created page with "*Covers ability to solder and heat shrink bulk wires. *Covers ability to solder to large heat sink surfaces *Tricks for soldering for component sizes smaller than soldering ir...")
 
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Latest revision as of 18:43, 23 February 2019

  • Covers ability to solder and heat shrink bulk wires.
  • Covers ability to solder to large heat sink surfaces
  • Tricks for soldering for component sizes smaller than soldering iron tip.
  • Soldering surface mount components by heating them up to melt them onto a solder pad
  • Reflow oven for soldering of entire surface mounted circuit
  • Leads to Open Source Pick and Place Machine Design 101.