PCB Production Workflows: Difference between revisions
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=Resistant Mask Methods= | =Resistant Mask Methods= | ||
==Paper Resist Transfer== | ==Paper Resist Transfer== | ||
==Marker Deposited Resist== | ==Marker Deposited Resist== | ||
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==Photoresist== | ==Photoresist== | ||
===DLP/Stencil etc?=== | ===DLP/Stencil etc?=== | ||
* | *Seems to be a desription of a simplified version of this here [[Easy pcb making]] ? '''Needs page refining + research etc''' | ||
===Selective Laser Photoresist Activation=== | ===Selective Laser Photoresist Activation=== | ||
Revision as of 03:14, 24 April 2020
Basics
- This page goes over, and intends to organize, the various ways to make a pcb
Resistant Mask Methods
Paper Resist Transfer
Marker Deposited Resist
Selective Mask Ablation
- Uses a laser to ablate the mask
Photoresist
DLP/Stencil etc?
- Seems to be a desription of a simplified version of this here Easy pcb making ? Needs page refining + research etc
Selective Laser Photoresist Activation
Milling Processes
- Functionally still a pcb, but technically may be a MCB or a