High Temperature Heated Enclosure: Difference between revisions

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=Concept=
Y separating all electronics and including only the extruder nozzle in the working volume - a heated chamber can be built for up to any required temperature up to the melting point of the build plate. The key is a stationary enclosure and a moving lid attached to the extrudsr, with a thermal seal between the chamber and the lid.
=Working Document=
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<html><iframe src="https://docs.google.com/presentation/d/e/2PACX-1vRxmyaqpm1o5UE7EyWRpTnhuB2jQfcIdPQTOERfFZEzWio8uIetncb410JyiKxLbGTfNZB-toa2XKiK/embed?start=false&loop=false&delayms=3000" frameborder="0" width="960" height="749" allowfullscreen="true" mozallowfullscreen="true" webkitallowfullscreen="true"></iframe></html>


[https://docs.google.com/presentation/d/1ICLb5wy5xAyOefL01OfQgzJgMOqEauxPz8fi59MgvIE/edit#slide=id.g45ed589c64_0_0 edit]
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Revision as of 18:22, 3 March 2019

Concept

Y separating all electronics and including only the extruder nozzle in the working volume - a heated chamber can be built for up to any required temperature up to the melting point of the build plate. The key is a stationary enclosure and a moving lid attached to the extrudsr, with a thermal seal between the chamber and the lid.

Working Document

edit