OSE 3D Printed Circuits: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
Concept: a 3D printed board serves as a structure for holding components so they are easy to solder. This can be described as ''dead-bug soldering with support structures''. | Concept: a 3D printed board serves as a structure for holding components so they are easy to solder. This can be described as ''dead-bug soldering with support structures''. Note that [[Dead-Bug Soldering]] is useful for high frequency circuits - by the way. | ||
#3D print a circuit board with channels and physical infrastructure for holding all components. | #3D print a circuit board with channels and physical infrastructure for holding all components. | ||
Revision as of 20:18, 28 April 2019
Concept: a 3D printed board serves as a structure for holding components so they are easy to solder. This can be described as dead-bug soldering with support structures. Note that Dead-Bug Soldering is useful for high frequency circuits - by the way.
- 3D print a circuit board with channels and physical infrastructure for holding all components.
- Bend the leads so they touch, and use wires to solder as needed. For through-hole components, this is fine.
- This is not fine for small feature advanced microelectronics, but 2.54 mm components would work.
- Soldering is quick for 2 wire components that touch each other. We can have the 3D print serve as a holding structure that makes soldering easy.