OSE 3D Printed Circuits

Concept: a 3D printed board serves as a structure for holding components so they are easy to solder. This can be described as dead-bug soldering with support structures. Note that Dead-Bug Soldering is useful for high frequency circuits - by the way.

1. 3D print a circuit board with channels and physical infrastructure for holding all components.
2. Bend the leads so they touch, and use wires to solder as needed. For through-hole components, this is fine.
3. This is not fine for small feature advanced microelectronics, but 2.54 mm components would work.
4. Soldering is quick for 2 wire components that touch each other. We can have the 3D print serve as a holding structure that makes soldering easy.
5. 2nd option: wires snap in place if printed from elastomer. Ga 10 or 8 solid copper - just snap it in. Circuit cover finishes circuit. Components become 100% reusable!
6. 3rd connection option: Not also - if 2 leads are inserted into a hole, the hole can be plugged with a solid copper conductor for good contact.

(Not OSE circuits. See Dead-Bug_Soldering and Circuits on Plastic for source.)

OSE Relevance

• In upcoming Incentive Challenge - we can require structure integrated circuits that are 3D printed in 3D.