The Energy Question Has an Easy Solution

Energy payback is now as little as 0.5 years for utility scale PV. Not counting any open source integrated design improvements. To take it to 0.25 year energy payback time, which is impossible, and thus a perfect project for OSE to take on.

But if we start with 1MW of PV power, and use 1/2 of that for producing more PV - then the time to breed 20TW, starting from 1 MW - is :

Embodied Energy of PV

Component	Description	Typical Embodied Energy Share (% of module)
Silicon Feedstock & Ingot	Quartz → polysilicon → crystal growth (Czochralski or similar)	25–40%
Wafering	Slicing ingots into wafers (kerf loss, sawing energy)	10–20%
Cell Processing	Doping, diffusion, etching, deposition (PECVD), metallization	15–25%
Glass (Front Sheet)	Tempered low-iron solar glass (~3–4 mm)	10–20%
Encapsulant (EVA/POE)	Polymer layers for lamination	3–8%
Backsheet (or rear glass if bifacial)	Polymer backsheet or second glass layer	3–10%
Aluminum Frame	Extruded frame + finishing	5–15%
Junction Box & Wiring	Diodes, copper wiring, connectors	2–5%
Module Assembly	Lamination, curing, handling, factory overhead	3–8%
Total		~100%

For Upgraded Metallurgical Grade Silicon

Component	Description	Typical Embodied Energy Share (% of module, UMG silicon)
Silicon Feedstock & Refining (UMG)	Metallurgical silicon upgraded via slag refining / directional solidification (no Siemens process)	10–20%
Ingot Growth	Crystal growth or casting (lower purity requirements than electronic-grade)	10–20%
Wafering	Slicing or kerfless wafer production	10–20%
Cell Processing	Doping, diffusion, passivation, metallization	20–30%
Glass (Front Sheet)	Tempered low-iron solar glass (~3–4 mm)	15–25%
Encapsulant (EVA/POE)	Polymer layers for lamination	5–10%
Backsheet / Rear Glass	Polymer backsheet or second glass layer (bifacial increases share)	5–15%
Aluminum Frame	Extruded frame + finishing	8–18%
Junction Box & Wiring	Diodes, copper wiring, connectors	2–5%
Module Assembly	Lamination, curing, factory overhead	5–10%
Total		~100%