Open Source D3D PCB Laser Ablative System

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Basics

- Part of the Open Source Electronics Construction Set

- A device that uses a chemical resistant dark paint and a laser to create the traces in the maskant. This is then etched using a chemical etchant

- Can allow for easier production of large volumes of PCB's quickly when compared to the D3D CNC Circuit Mill

- This may be less complex when compared to the Open Source PCB Photoengraving System as this method only requires dark paint and a modified laser cutter to produce the traces



Used For

- PCB Production

- IC Production

- Possibly



Industry Standards

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Existing Open Source Devices

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Minimum Viable Product

- Fast

- Easy to Use (upload file and press print)

- Recycles its own / can use recycled chemicals

- Cheap to run

- Scalable (both in physical size ,and precision/ability (ie pcb engraving at the low end and cpu manufacture at the high end)



Basic Design

Feedstock Module

- 1 or more of these

- Holds PCB's, Silicon wafers etc


Conveyor Belt Module

- Carryies feedstock from the feedstock module to the next module

- should be relitively unreactive (ie Plastic or ceramic)


Prewash Module

- Washes and dries the feedstock to prevent contamination errors in the next modules


Dark Paint Application Module

- Applies the dark paint ( it is dark so it absorbs more laser energy )


Exposure Module

- Burns off the paint with the laser leaving behind exposed traces


Post Exposure Cleaning Module

- Cleans off the resedue from the burned paint


Etching Module

- Is a bath of chemical etchant that the conveyor belt dips into

- Dissolves the areas not protected by undeveloped photoresist


Post Etching Cleaning Module

- Removes the Etchant


Post Processing Module

- Removes any remaining photoresist + delivers the finished product to the end of the conveyor belt



BOM

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See Also

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Usefull Links

- Wikipedia Page on Printed Circuit Boards