Open Source D3D PCB Laser Ablative System
Contents
Basics
- Part of the Open Source Electronics Construction Set
- A device that uses a chemical resistant dark paint and a laser to create the traces in the maskant. This is then etched using a chemical etchant
- Can allow for easier production of large volumes of PCB's quickly when compared to the D3D CNC Circuit Mill
- This may be less complex when compared to the Open Source PCB Photoengraving System as this method only requires dark paint and a modified laser cutter to produce the traces
Used For
- PCB Production
- IC Production
- Possibly
Industry Standards
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Existing Open Source Devices
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Minimum Viable Product
- Fast
- Easy to Use (upload file and press print)
- Recycles its own / can use recycled chemicals
- Cheap to run
- Scalable (both in physical size ,and precision/ability (ie pcb engraving at the low end and cpu manufacture at the high end)
Basic Design
Feedstock Module
- 1 or more of these
- Holds PCB's, Silicon wafers etc
Conveyor Belt Module
- Carryies feedstock from the feedstock module to the next module
- should be relitively unreactive (ie Plastic or ceramic)
Prewash Module
- Washes and dries the feedstock to prevent contamination errors in the next modules
Dark Paint Application Module
- Applies the dark paint ( it is dark so it absorbs more laser energy )
Exposure Module
- Burns off the paint with the laser leaving behind exposed traces
Post Exposure Cleaning Module
- Cleans off the resedue from the burned paint
Etching Module
- Is a bath of chemical etchant that the conveyor belt dips into
- Dissolves the areas not protected by undeveloped photoresist
Post Etching Cleaning Module
- Removes the Etchant
Post Processing Module
- Removes any remaining photoresist + delivers the finished product to the end of the conveyor belt
BOM
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See Also
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