PCB Production Workflows: Difference between revisions
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==Selective Mask Ablation== | ==Selective Mask Ablation== | ||
*Uses a laser to ablate the mask | *Uses a laser to ablate the mask | ||
*Could be a dedicated device such as the [[Open Source D3D PCB Laser Ablative System]] , but would most likely be via the [[Open Source Laser Diode Toolhead]] | |||
==Photoresist== | ==Photoresist== | ||
Revision as of 03:18, 24 April 2020
Basics
- This page goes over, and intends to organize, the various ways to make a pcb
Resistant Mask Methods
Paper Resist Transfer
Marker Deposited Resist
Selective Mask Ablation
- Uses a laser to ablate the mask
- Could be a dedicated device such as the Open Source D3D PCB Laser Ablative System , but would most likely be via the Open Source Laser Diode Toolhead
Photoresist
DLP/Stencil etc?
- Seems to be a desription of a simplified version of this here Easy pcb making ? Needs page refining + research etc
- Page is a mess, but an OSE industrial machine for this would be a Open Source PCB Photoengraving System
Selective Laser Photoresist Activation
Milling Processes
- Functionally still a pcb, but technically may be a MCB or a