Open Source Circuit Making: Difference between revisions
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=Basics= | |||
* [[FLOSHW]] production of [[PCB]] 's | |||
=Workflows= | |||
*You can apply lines of solder paste for small-wire components much finer than you can with a soldering iron by doing it in bulk with 1 line of paste, and hot air. The small leads wick up the solder. You first apply paste, you heat it to dry it, and then use hot air to wick it up. This is a way to solder features much finer than soldering. [https://www.youtube.com/watch?v=f_yFDpSTfao] | *You can apply lines of solder paste for small-wire components much finer than you can with a soldering iron by doing it in bulk with 1 line of paste, and hot air. The small leads wick up the solder. You first apply paste, you heat it to dry it, and then use hot air to wick it up. This is a way to solder features much finer than soldering. [https://www.youtube.com/watch?v=f_yFDpSTfao] | ||
=Internal Links= | |||
*[[OCI]] | |||
*[[ | |||
=External Links= | |||
* | |||
Revision as of 20:59, 29 May 2020
Basics
Workflows
- You can apply lines of solder paste for small-wire components much finer than you can with a soldering iron by doing it in bulk with 1 line of paste, and hot air. The small leads wick up the solder. You first apply paste, you heat it to dry it, and then use hot air to wick it up. This is a way to solder features much finer than soldering. [1]
Internal Links
- OCI
- [[