Recyclable Electronics: Difference between revisions
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(Created page with "*Circuit board is etched, routed *Surface mount components attached with paste, reflow *Thru-hole can be mounted if needed - though these should be on a separate board for sim...") |
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Revision as of 17:59, 8 December 2023
- Circuit board is etched, routed
- Surface mount components attached with paste, reflow
- Thru-hole can be mounted if needed - though these should be on a separate board for simplicity, which can be socketed design for zero solder
- Permanence on socketed design is via epoxy layer - ruggedization, vibration, space, war
- Socketed components have plug-in devices with heatsinks, socketed devices are thus infinitely scalable
- At the final level, the circuits are deposited, not etched. At this higher temp, the circuits can be likewise recycled by separation, typically copper? deposited on high temperature ceramic
- 100% recyclability, zero waste, reconfigurability. Authentic Construction Set approach.