Recyclable Electronics: Difference between revisions
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(Created page with "*Circuit board is etched, routed *Surface mount components attached with paste, reflow *Thru-hole can be mounted if needed - though these should be on a separate board for sim...") |
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*Circuit board is etched, routed | *Circuit board is etched, routed | ||
*Surface mount components attached with paste, reflow | *Surface mount components attached with paste, reflow. To recycle components - simply melt and shake them off, with heat applied back side to protect sensitive components | ||
*Thru-hole can be mounted if needed - though these should be on a separate board for simplicity, which can be socketed design for zero solder | *Thru-hole can be mounted if needed - though these should be on a separate board for simplicity, which can be socketed design for zero solder | ||
*Permanence on socketed design is via epoxy layer - ruggedization, vibration, space, war | *Permanence on socketed design is via epoxy layer - ruggedization, vibration, space, war | ||
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*At the final level, the circuits are deposited, not etched. At this higher temp, the circuits can be likewise recycled by separation, typically copper? deposited on high temperature ceramic | *At the final level, the circuits are deposited, not etched. At this higher temp, the circuits can be likewise recycled by separation, typically copper? deposited on high temperature ceramic | ||
*100% recyclability, zero waste, reconfigurability. Authentic Construction Set approach. | *100% recyclability, zero waste, reconfigurability. Authentic Construction Set approach. | ||
*Ceramic is produced in house | |||
*Copper is recycled in house | |||
*Relates to [[Air Separation]] and cryogenics for generating argon shielding gas, also used in welding, laser 3D printers, and other hot metal processing. | |||
Latest revision as of 18:03, 8 December 2023
- Circuit board is etched, routed
- Surface mount components attached with paste, reflow. To recycle components - simply melt and shake them off, with heat applied back side to protect sensitive components
- Thru-hole can be mounted if needed - though these should be on a separate board for simplicity, which can be socketed design for zero solder
- Permanence on socketed design is via epoxy layer - ruggedization, vibration, space, war
- Socketed components have plug-in devices with heatsinks, socketed devices are thus infinitely scalable
- At the final level, the circuits are deposited, not etched. At this higher temp, the circuits can be likewise recycled by separation, typically copper? deposited on high temperature ceramic
- 100% recyclability, zero waste, reconfigurability. Authentic Construction Set approach.
- Ceramic is produced in house
- Copper is recycled in house
- Relates to Air Separation and cryogenics for generating argon shielding gas, also used in welding, laser 3D printers, and other hot metal processing.