Recyclable Electronics

From Open Source Ecology
Revision as of 17:59, 8 December 2023 by Marcin (talk | contribs) (Created page with "*Circuit board is etched, routed *Surface mount components attached with paste, reflow *Thru-hole can be mounted if needed - though these should be on a separate board for sim...")
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search
  • Circuit board is etched, routed
  • Surface mount components attached with paste, reflow
  • Thru-hole can be mounted if needed - though these should be on a separate board for simplicity, which can be socketed design for zero solder
  • Permanence on socketed design is via epoxy layer - ruggedization, vibration, space, war
  • Socketed components have plug-in devices with heatsinks, socketed devices are thus infinitely scalable
  • At the final level, the circuits are deposited, not etched. At this higher temp, the circuits can be likewise recycled by separation, typically copper? deposited on high temperature ceramic
  • 100% recyclability, zero waste, reconfigurability. Authentic Construction Set approach.